Wire-bonding – ASM EAGLE EXPRESS
The ASM EAGLE EXPRESS is a wire-bonding machine designed to create fine electrical interconnections between chips, sensors, or microdevices and their integration supports, such as PCBs, ceramic substrates, or electronic packages. It enables the bonding of very small metallic wires with a diameter of 50 µm. It strengthens our prototyping capabilities by facilitating packaging, interconnection, and electrical validation of sensor devices developed in the laboratory.